KEY FEATURES OF SOLDERLESS BREADBOARD 830:
- Tie-points: 830
- Spring Contacts: Throat embossed stainless steel
- Color: Off-white
- Power Rails: Splitted
- Recommended Insertion Range: 26-20 AWG
Solderless breadboards are used for prototyping electronic circuits by inserting components and wires into spring contacts. This allows circuits to be easily and quickly constructed without soldering. It also allows components to be reused multiple times in different circuits.
With 830 tie-points, this size of breadboard is good for small to medium projects.
Notes:
These are designed to work with components such as IC’s which have standard 0.1″ spacing. Components with other lead spacing such as 2mm may work if the leads can be reformed to fit the 2.54mm pitch of the breadboard
TECHNICAL SPECIFICATIONS
| Tie-points | 830 | |
| Spring Contacts | Material | Stainless steel |
| Design | Embossed throat | |
| Power Rails | x2 | Splitted |
| Housing | Material | ABS plastic |
| Color | Off-white | |
| Lead Openings | Square hole | |
| Conductor Gauge | For making interconnects | 20-29AWG (20-26 recommended) |
| Grid Spacing | Adjacent tie-points | 0.1″ (2.54mm) |
| Dimensions | 165 x 55 x 10mm |
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