AMTECH Flux Paste NC-559-ASM 100g

Features:

• 100% brand new high quality
• Made of high-quality materials for durability
• NC-559-ASM BGA Flux Solder Paste Flux 100g Flux.
• No-clean solder paste.
• Less residue, welding light, less smoke, no irritating odor.
• High viscosity no-clean fluxes can be used for rework, ball or lead attachment to BGA, CGA and CSP packages and assembly operations.
• For example, the flip chip is fixed on the PWB substrate, and the good formula of BGA ball/ball can make the ball fit better.

Specification:

• Model: NC-559-ASM
• Main ingredient: flux synthetic resin
• Color: yellow paste
• Melting point (C): 50
• Boiling point (C): 300
• Weight: 100g
• Scope of application: used for BGA, CSP and other ball array solder joint repair and ball replacement.

Applications:

For soldering and reballing of computer and phone chips. PC card. electronic chip-level flux soldering