Features:
- Low Melting Point Melts at 138°C, ideal for heat-sensitive components and materials.
- High Adhesion Ensures secure bonding for precise and reliable solder joints.
- Minimal Residue Leaves little to no residue, reducing the need for cleaning.
Specifications:
- Brand: MaAnt
- Model: MY-38A.
- Microns: 20-38um.
- Particles: 25-40um
- Weight: 50g
- Melting Point: 138°C
- Dimensions: 41mm(L) x 34.8mm(W)
- Alloy: Sn42Bi58
- Composition: Alloy with Tin (Sn) 42%, Bismuth (Bi) 58% , and other components
- storage: 0-10 c
Application:
- Suitable for both manual and automated soldering processes
- Ideal for rework, sphere or pin attachment to BGA, PGA, and CSP packages.
- Suitable for assembling operations such as Flip Chip attachment to PWB substrates.
- Essential for PCB reflow processes and small component soldering.
- Suitable for SMD soldering, PCB assembly, and rework projects.
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