RL-044 QU5 RELIFE Precision BGA Stencils
The RL-044 QU5 RELIFE Precision BGA Stencils are advanced tools tailored for reballing and repairing Ball Grid Array (BGA) chips. These stencils are engineered to provide exceptional accuracy and durability, making them an indispensable choice for professional repair technicians and electronics enthusiasts. Designed with precision laser-cut technology, they ensure consistent and efficient soldering, ideal for handling complex electronic components.
Features:
- High Precision: Laser-cut apertures guarantee accurate alignment and consistent solder paste application.
- Premium Material: Made of high-quality stainless steel, offering excellent durability and resistance to heat.
- Custom Design: Features layouts optimized for a variety of common BGA chip sizes and configurations.
- Universal Compatibility: Suitable for a wide range of BGA components, including ICs, CPUs, and GPUs.
- Heat Resistance: Can withstand high soldering temperatures without deforming or warping.
- Compact and Lightweight: Easy to handle, store, and transport.
- Reusable: Built for repeated use, making it a cost-effective option for repair work.
- Polished Surface: Smooth finish prevents damage to chips and facilitates easy cleaning.
Specifications:
- Brand: RELIFE
- Model: RL-044 QU5
- Material: Stainless steel
- Number of Layouts: 8
- Thickness(Approx.): 0.1 mm
- Hole Accuracy: ±0.01 mm
- Standard Size Dimensions(L x W): 10 cm x 8 cm
- Package Size(L x W): 130 mm x 120 mm
- Surface Finish: Polished and heat-treated for enhanced durability
Applications:
- Chip Reballing.
- Electronics Repair.
- PCB Maintenance.
- Prototype Testing.
- Education and Training.
- DIY Electronics Projects.
