MaAnt MY-83A 183°C Low Temperature Solder Paste 50g
The MaAnt MY-83A 183°C Low Temperature Solder Paste 50g is a high-performance soldering solution engineered for precision and reliability in electronics repair and printed circuit board (PCB) assembly. Formulated with a tin-lead-silver alloy (Sn/Pb/Ag0.4), this solder paste melts at 183°C, offering excellent wetting properties and robust soldering performance. Its fine particle size, ranging from 20 to 38 microns, ensures uniform paste deposition, resulting in consistent and reliable solder joints, which are critical for high-density interconnect applications and delicate electronic components.
Features:
- Melting point of 183°C for controlled soldering.
- Sn/Pb/Ag0.4 alloy for enhanced strength and conductivity.
- Fine particle size of 20-38µm for uniform application.
- Sticky, nonfoaming texture for even solder beads.
- Firm and durable welds for reliable connections.
- 50g container for multiple soldering projects.
- Storage at 0-10°C to maintain optimal performance.
Specifications:
Applications:
- Repair of PCB motherboards for smartphones and other devices.
- Maintenance and soldering of PCB components.
- Ball grid array (BGA) tin planting and rework.
- General electronics soldering for professional and hobbyist use.
- Assembly of high-density interconnect circuits.
Package Include:
1x MaAnt MY-83A 183°C Low Temperature Solder Paste 50g.