Electronics Solder Paste 185-240°C Sn63-Pb37 15g

Solder Paste 15g for PCB/SMD/BGA/PGA

Solder Paste for repairing electronic boards, PCs, Laptops, Smartphones, playstation, Satellite Receiver and all sensitive electronic appliances by using tin soldering iron, hot air soldering station and SMT/BGA rework station.

Specifications:

• Particle Size:30-45 Micron
• Alloy: Sn63/Pb37
• Melting Point: 185-240 Celsius

Features:

• Suitable to stencil printing (holes larger than 0.45mm).
• Good conductivity and oxidation resistance.
• High purity and soft soldering.
• Bright and full solder joints.
• No residue solid after rework and easy cleaning.
• Halogen free.

Usage:

• Repairing electronic boards such as PCB/SMD/BGA/PGA for PCs, Laptops, Smartphones, playstation, Satellite Receiver and all sensitive electronic appliances.
• Reballing BGA chipset with reballing stencil (holes larger than 0.45mm).
• Repairing phones, as well as replacement SMD component, micro switches and charging connectors.
• Soldering electrical control boards.
• Soldering all copper alloys, wires, lithium ion batteries and solderable surfaces as nickel strips.

Usage Recommendations (very important):

• Follow safety precautions & notes.
• Clean the surface (Clear any residues or dust).
• Put a very little bit of solder paste before soldering.
• Use a suitable soldering iron tip with the target area.
• Use a suitable soldering iron with the target size.
• Use a suitable soldering station with the target component.
• Use a wet soldering sponge for cleaning the tip and during soldering.
• Use thinner or any alcohol for cleaning.

Notes:

• For best results, follow the usage recommendations.
• Don’t put soldering iron tip in the solder paste.
• Not suitable with welding by fusion or flame.

Safety Precautions:

• Close after using & keep away from children.
• Use enough water when eyes or wounds are touched.

Appearance:

The solder paste is a soft paste, packaged in a round plastic can -net weight 15g.

Thanks for Your Trust