Heatsink Plaster Thermal Silicon Adhesive Cooling Paste – Thermal Grease

Product performance:

Good thermal conductivity, and strong adhesion. The vacuum package is not easy to oxidize and dry out. Good viscosity. Short drying time. Good performance. Various chips are recommended for heat dissipation.
It is a one-component room-temperature vulcanized silica gel with good thermal conductivity and insulation. The product has good conductivity and a wide temperature range.
It can withstand high temperatures of 300℃ in a short time. In addition, it has a short surface curing time, strong adhesion, a long storage period, is solvent-free, and can be safely used in the elastic bonding, heat dissipation, insulation, and packaging of electronics, electrical appliances, instrumentation, LED, heat sink, and other industries.

STARS-922 Heatsink Plaster Thermal Silicone Adhesive Cooling Paste Strong Adhesive Compound Glue For Heat Sink Sticky ST922

• N.W.: 5g
• Thermal conductivity : >0.671 W/m-k
• Thermal resistance: <0.06 °C-in2/W

Used to paste heat sink with IC chips, and be a cooling body with a good thermal effect

Scope of application:

It has a high-strength, fast-speed bonding effect, and is suitable for various components that need to be directly bonded firmly, LEDs and heat sinks, etc.
1. Used as a heat transfer medium for electronic components.
2. Computer CPU, GPU (graphics card chip), radiator gap filling, and heat conduction.
3. The filling of the gap between the high-power transistor and the aluminum
4. The filling of the gap where the silicon-controlled element diode contacts the aluminum
5. Reduce the working temperature of various heating elements, etc.

Product performance:

Good thermal conductivity, and strong adhesion. The vacuum package is not easy to oxidize and dry out. Good viscosity. Short drying time. Good performance. Various chips are recommended for heat dissipation.
It is a one-component room-temperature vulcanized silica gel with good thermal conductivity and insulation. The product has good conductivity and a wide temperature range.
It can withstand high temperatures of 300℃ in a short time. In addition, it has a short surface curing time, strong adhesion, a long storage period, is solvent-free, and can be safely used in the elastic bonding, heat dissipation, insulation, and packaging of electronics, electrical appliances, instrumentation, LED, heat sink, and other industries.

Instructions:

1. When using, directly squeeze out the product, rub it with the surface of the adherend, and cover it immediately after use, in case it is tried again;
2. The surface fixation speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa;
3. Recommended coating thickness: 0.1-0.5mm, the thinner the better.
4. Please clean the surface of the bonded object with a solvent (such as alcohol) before use. Do not use detergent to clean it. Do not apply it until the surface is clean.
Packing specification: 5g/piece (packing has good air tightness, and the outer vacuum bag isolates the air, which increases the storage time).