Feature:
- Professional advanced OEM RMA-223/559 BGA soldering paste flux+squeeze tube +free needle tip.
- 100% new brand and high quality.
- Good immersion and high intensity joint.
- Easy to peel off with hands or tweezers, leave no residue.
- Won’t oxidating gold, copper, phosphorus, bronze, oxidation.
- Prevent contamination during assembly.
- RMA-223/559: high viscosity no-clean flux, reprocessing PCB, BGA, PGA , for soldering computer/phone chips.
- RMA-223/559 is the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue.
- High soaking ,high strength joints.
- No-toxic, no-corrosive, strong ability of insulation.
- Good insulation and smooth welding surface.
- No deterioration no dry.
- No poison no orrosion, no damage to parts.
Specification:
- Flux Type: UV-559
- Volume: 10ml/10cc
- Dimension: 93 x 33 x 23mm
- Material: the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue.
- Color: off white
- Insulated: Yes
- Advantage: Good immersion and high intensity joint.
- Function: for BGA , PGA Reworkin.
Applications:
for soldering and reballing of computer and phone chips. PC card. electronic chip-level flux soldering
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