MECHANIC Solder Paste XG-50 35gm 183°C

The MECHANIC Solder Paste XG-50 (35gm) 183°C is a leaded solder paste with a Sn63/Pb37 alloy, 3-micron particle size, and 183°C melting point, ideal for SMD soldering applications.

235.00 EGP

Join the waitlist to be emailed when this product becomes available

Availability: Out of stock
SKU:3496300074907
Brand:

Precision Soldering Made Easy: MECHANIC XG-50 Solder Paste for Flawless Connections

MECHANIC Solder Paste XG-50 35gm 183°C is a high-performance soldering paste designed to provide superior soldering results. It is specifically formulated for use in electronics and PCB assembly. The paste features a low melting point of 183°C, making it ideal for a variety of soldering applications where precision and reliability are crucial.

This solder paste is designed for use with both manual and automated soldering processes, ensuring a strong and clean bond between components and the PCB. The XG-50 variant offers excellent wetting properties, allowing for smooth flow during the soldering process, which helps prevent cold solder joints and bridges. It is formulated to ensure the highest quality connections, resulting in reliable and long-lasting electronic circuits.

The MECHANIC Solder Paste XG-50 comes in a convenient 35g container, making it easy to apply without wastage. Its smooth consistency ensures consistent application, whether you’re working on small or large projects. This solder paste is compatible with a wide range of PCB components, making it a versatile tool for professionals and hobbyists alike.

Features:
  • Low Melting Point: Melts at 183°C for efficient soldering.
  • High-Quality Soldering: Ensures clean, reliable joints.
  • Excellent Wetting Properties: Smooth flow prevents cold solder joints.
  • Convenient Packaging: Comes in a 35g container for easy handling.
  • Versatile Use: Suitable for both manual and automated soldering.
  • Strong Bond: Provides durable connections for electronic components.
  • Non-corrosive: Safe for use on sensitive electronic components.
Specifications:
Feature Specification
Product Type: Solder Paste
Weight: 35g
Melting Point: 183°C
Application: PCB Assembly, Soldering
Composition: Flux and Solder Powder
Viscosity: Medium
Package Type: Jar
Compatibility: Manual and Automated Soldering
Storage: Keep in a cool, dry place
Applications:
  • PCB Assembly.
  • Electronics Soldering.
  • SMD Component Soldering.
  • Rework and Repair.
  • DIY Electronics Projects.
  • Automated Soldering Machines.
Warning:
  • Harmful by inhalation and if swallowed.
  • The danger of cumulative effects.
  • Keep away from food, drink, and animal feeding stuff.
  • When using do not eat, Drink, or smoke.
  • Avoid prolonged or repeated contact with any skin with solder paste. In case of solder paste ingestion see a doctor immediately.
  • Store the container well closed and cool.
Package Contents:
  • 1x MECHANIC Solder Paste XG-50 35gm 183°C

Reviews

There are no reviews yet.

Only logged in customers who have purchased this product may leave a review.

Product has been added to your cart