Product Features
- High synthetic BGA Solder Paste Tin Rosin-Based Flux Paste Cream.
- PH value neutral, insulation is strong, welding surface smooth.
- Professional Soldering Tin Flux for PC Cards Electronic Chip-level Welding.
- Its boiling point is only slightly higher than the melting point of the solder.
- Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding, and so on.
- Good soldering and welding tools.
- IC and PCB for no corrosive
- Super compacity: Applicable to PCB, BGA, SMD, PGA repair repair, Soldering, etc.
- Rosin-based Solder Paste.
Product Specifications
- Material: Plastic+ Rosin-based solder paste
- Type: Rosin-based BGA solder flux cream
- Model Number: UV50
- Viscosity: 0.2Pas
- Granularity: 0.22um
- Application: for Phone BGA Board Soldering Fixing
- Function: PC Cards Electronic Chip-level Welding
Instructions:
1. Wipe the surface of the object before soldering
2. Apply the paste flux to the solder joint
3. Solder the tin to the solder joint with a soldering iron.
