OSS TEAM W110+ BGA Repair Blade Set 27 PCS

OSS TEAM W110+ BGA Repair Blade Set 27 PCS

The OSS Team W110+ BGA Repair Blade Set is a precision tool kit designed for delicate motherboard and BGA chip repair. With 27 meticulously shaped blades crafted from durable alloy steel, this set enables technicians to carefully scrape underfill, pry chips, or lift components without damaging copper traces or adjacent parts. The blades are ultra-thin thinner than typical tin solder points to glide between the chip and PCB surface with minimal resistance.

Each blade features a specific angle and profile to address varied repair scenarios ranging from scraping adhesive residue around CPU or baseband chips to lifting chips with underfill intact. The included handle securely holds these blades, bringing precision control. The high-quality alloy steel resists peeling or breaking, and is easy to clean, ensuring reliable performance during repeated use.

The set’s versatility and fine design make it indispensable in BGA-level electronics repair. Ideal for professionals working on smartphones, laptops, or gaming consoles, it supports careful chip removal and board cleanup. Its thin, temperature-resistant blades, combined with a practical handle, help eliminate risks like lifted pads or board scratches making soldering rework processes safe and efficient.

Features:

• 27 distinct ultra-thin alloy steel blades plus one ergonomic handle.
• Blades crafted thinner than solder points for delicate access.
• Resistant to peeling and breakage; easy to clean.
• Precision angles tailored for scraping underfill, prying, and lifting chips.
• Durable, heat- and oxidation-resistant steel.

Specifications:

Applications:

• Scraping underfill around BGA chips.
• Lifting BGA chips with underfill.
• Prising open ICs from motherboards or mobile PCBs.
• Chip removal in fine-pitch rework.

Package Contents:

• 27x  distinct alloy steel blades