OSS TEAM W120+ Demolition CPU Tool Kits for BGA Repair

OSS TEAM W120+ Demolition CPU Tool Kits for BGA Repair

The OSS TEAM W120+ Demolition CPU Tool Kit is a specialized instrument designed for BGA (Ball Grid Array) chip repairs, including tasks like baseband and CPU rework. This tool is engineered to facilitate precise and efficient removal of BGA chips without causing damage to the motherboard.

Featuring a thin blade design, the W120+ allows for unobstructed movement between the chip and the board’s surface. This design minimizes the risk of damaging the motherboard during the removal process. It is compatible with hot air rework stations operating at temperatures between 340°C and 360°C, with a wind speed of 28–30 m/s, ensuring optimal performance and safety.

The tool’s design ensures that it does not peel copper or leave residue, making it easy to clean after use. Its ergonomic construction provides a comfortable grip, reducing the risk of accidents during operation. When used correctly, the W120+ offers a safe and effective solution for BGA chip removal and rework tasks.

Features:

• Thin blade design for precise BGA chip removal.
• Compatible with hot air rework stations (340–360°C, 28–30 m/s).
• Prevents copper peeling and residue buildup.
• Ergonomic handle for comfortable grip.
• Easy to clean after use.
• Safe and risk-free operation.

Specifications:

Applications:

• BGA Chip Removal.
• Baseband Rework.
• CPU Rework.
• Motherboard Repair.
• Mobile Device Repair.
• Electronics Rework.
• Soldering Tasks.
• Precision Cutting.
• Rework Station Compatibility.
• DIY Repair Projects.

Package Contents:

• 1× OSS TEAM W120+ Demolition CPU Tool
• 1× Protective Blade Cover