RELIFE HO1 NANO Cleaning Sponge

RELIFE HO1 NANO Cleaning Sponge

Imagine a cleaning tool so refined that it seems to vanish into your repair routine thin, pliable, and engineered to work in the tightest corners of a circuit board, screen or connector. The HO1 Nano Cleaning Sponge presents itself as this silent partner: a pre-cut, high-density material ready to tackle dust, flux residue and micro-particles that often evade conventional wipes.

When applied, the sponge offers a smooth, controlled surface that glides over glass, plastic or metal without snagging, leaving no lint behind and no micro-scratches on sensitive components. It absorbs contaminants with surprising efficiency, giving you the visual confidence that the substrate is clean and ready for the next stage whether that’s inspection, bonding or thermal work.

As part of your toolkit, this sponge becomes more than just a consumable: it reflects a shift towards precision cleaning in electronics repair. With its nano-structured material, each little piece pulls out stray particles, flushes out tiny pools of residual solvent and prepares surfaces in a way that elevates the result. In short, this HO1 sponge offers a blend of minimal fuss, maximal cleanliness and consistent performance for those who work at fine scale.

Features:

• High-density nano-structured cleaning sponge for efficient debris removal.
• Pre-cut particle format for convenience and ready-to-use immediacy.
• Lint-free, snag-free design leaving no residue behind.
• Strong adsorption capacity for flux, dust and microscopic contaminants.
• Compatible with a range of cleaning agents and solvent workflows.

Specifications:

Applications:

• LCD screen and glass surface cleaning.
• PCB and motherboard cleaning in electronics repair.
• Connector and socket maintenance.
• Precision component cleaning (SMD, BGA, FFC contacts).
• Cleaning before adhesive or bonding workflows.

Package Contents:

• 1x RELIFE HO1 NANO Cleaning Sponge