RELIFE RL-403B Leaded Solder Ball 0.3mm

RELIFE RL-403B Leaded Solder Ball 0.3mm

At first glance, the RL-403B solder ball set presents itself as a fine-precision solution for micro-soldering tasks. Each sphere, just 0.3 mm in diameter, conveys the subtlety of modern electronics repair work where every tiny pad and minute trace demands reliability in connection and repeatability in performance. Holding the tiny bottle, you sense that this is not just “lots of metal” but metal crafted with purpose: each ball formed to exacting diameter, ready to become part of a circuit’s pathway.

In use, you dispense one of the tiny balls onto a solder pad beneath a BGA chip or other small-footprint package. You apply flux, heat engaged, and watch as the sphere melts and merges into the network of joints beneath. The process is quiet but exacting; the ball disappears into function, performing its role without fanfare. The melting point, the surface finish, the consistency all converge so that you can focus on placement rather than fighting variance.

Once the soldering process completes, the circuit hums back to life. These small balls leave no oversized footprint, no excess bulk instead they enable precision, compact, and repeatable connections. The RL-403B becomes part of the technician’s toolbox: a go-to when micro-repair demands exact connection, minimal footprint, and high reliability. It doesn’t call attention to itself—it simply helps restore functionality with clarity and subtlety.

Features:

• Highly uniform sphere diameter to ensure consistent melting and even connection.
• Smooth surface finish on each ball to prevent oxidation or irregular melting onset.
• Melting point of approximately 183 °C, aligning with common leaded solder profiles.
• Packaged in bulk (≈ 25,000 pieces per bottle) to support repeated micro-repair jobs.
• Availability in multiple diameters (0.2 mm up to 0.65 mm) for flexibility across various pad sizes and component types.

Specifications:

Applications:

• BGA chip rework and micro-soldering on motherboards.
• Precision solder ball placement for circuit board manufacturing.
• Repair of fine-pitch components and miniature electronics.

Package Contents:

• 1x RELIFE RL-403B Leaded Solder Ball 0.3mm