RELIFE RL-548 Solder Paste Thinner

RELIFE RL-548 Solder Paste Thinner

The RELIFE RL‑548 Solder Paste Thinner is a precision consumable designed to optimize the viscosity and consistency of solder paste for electronics repair and assembly. It is suitable for use with both leaded and lead‑free solder pastes, allowing technicians to restore aged or thickened solder materials to an ideal flow state, ensuring smoother application and improved soldering results. Featuring a transparent formulation and easy‑to‑use dispensing nozzle, the RL‑548 provides accurate control over thinner volume, making it suitable for fine PCB work, SMD rework, and detailed mobile or board repairs. This thinner enhances solder paste activity and helps prevent issues such as poor adhesion, clumping, and inconsistent solder joints.

Features:

• Eco-friendly and tasteless formulation for safe use.
• Strong solvency to effectively dilute dried solder paste.
• Enhances solder paste activity for better flow and adhesion.
• Compatible with both leaded and lead-free solder pastes.
• Fully sealed to prevent volatilization and leakage.
• Thickened bottle with sharp nozzle for precise dispensing.
• Adjusts consistency for precise applications in repairs.

Specifications:

Applications:

• Diluting and restoring consistency of solder paste in phone repairs.
• Enhancing solder paste activity for mobile motherboard debugging.
• Adjusting viscosity in electronic manufacturing processes.
• Revitalizing dried tin pulp for precise soldering tasks.
• Supporting maintenance in smart electronics and device assembly.

Package Include:

1x RELIFE RL-548 Solder Paste Thinner (10ml).