RL-044 RELIFE Precision BGA Stencils

RL-044 RELIFE Precision BGA Stencils

The RL-044 RELIFE Precision BGA Stencils are professional-grade tools designed for reballing and repairing Ball Grid Array (BGA) components. These stencils are precision-engineered to cater to a wide range of BGA layouts, ensuring accurate alignment and efficient soldering. Constructed from high-quality stainless steel, they are ideal for both repair technicians and electronics enthusiasts looking for reliable, reusable, and versatile solutions for BGA rework.

Features:

• High Precision Design where Laser-cut apertures for precise solder paste application and perfect chip alignment.
• Durable Material where crafted from stainless steel for enhanced durability and heat resistance.
• Multiple Layouts where accommodates a variety of BGA chip configurations, making it suitable for a range of devices.
• Heat Resistant where withstands high soldering temperatures without deformation.
• Lightweight and Compact where easy to handle and store, perfect for on-the-go technicians.
• Designed for repeated use, providing long-term cost efficiency.
• Polished Surface where smooth finish ensures effortless cleaning and prevents damage to components.
• Universal Application where compatible with CPUs, GPUs, ICs, and other BGA chips.

Specifications:

• Brand: RELIFE.
• Model: RL-044
• Material: Stainless steel
• Number of Layouts: 16
• Thickness(Approx.): 0.1 mm
• Hole Accuracy: ±0.01 mm
• Standard Size Dimensions(L x W): 10 cm x 8 cm
• Package Size(L x W): 130 mm x 120 mm
• Surface Finish: Polished and heat-treated for enhanced durability

Applications:

• Chip Reballing.
• Electronics Repair.
• PCB Maintenance.
• Prototype Testing.
• Education and Training.
• DIY Electronics Projects.