RL-044 SAMEU4 RELIFE Precision BGA Stencils

RL-044 SAMEU4 RELIFE Precision BGA Stencils

The RL-044 stencil embodies RELIFE’s precision engineered craftsmanship in micro-electronics repair. It arrives as a delicately etched steel mesh, ultra-thin yet robust, designed to align with microscopic BGA pads with remarkable accuracy. Its surface bears both round and square perforations, each cut with immaculate edges so that molten solder flows without obstruction or bridging. The layout exhibits careful symmetry and consistency, serving to guide solder paste or balls exactly where needed.

When handling, one immediately senses the care in its design. Ventilation or “cooling” holes are subtly incorporated, allowing heat to escape and thus preventing damage or warping under thermal stress. Meanwhile, partial etching around certain areas creates grooves that accommodate adjacent components, protecting them from overheating or mechanical interference. Though small, these design touches raise the stencil from merely functional to thoughtful.

Packaging contributes to its quality: RL-044 is delivered in a protective envelope or blister form, reinforced with stiff backing to avoid bending or deformation during transit. The steel remains flat, edges sharp and clean. To the user, the experience evokes precision, durability, and professional reliability ideal for fine rework work where every micron counts.

Features:

• Pioneering half-etching process that creates grooves for nearby components, helping prevent burns.
• Patented cooling-hole design to dissipate heat efficiently during soldering.
• Ultra-precise hole positioning (round and square), making removal of excess steel easier and ensuring more accurate application.
• Double blister packaging with hard paper backing to protect the stencil from crushing or deformation during shipment.

Specifications:

Applications:

• iPhone Motherboard Repair (e.g., iPhone 7 to 13 Pro Max series for CPU, baseband, Wi-Fi, NFC BGA components)
• Samsung Smartphone Chip Repair (e.g., Exynos and Qualcomm series CPUs like Exynos 8895 with Qualcomm 835/MSM8998)
• Xiaomi/Redmi Device BGA Reballing (compatible with various Xiaomi and Redmi CPU models)
• Huawei Phone Chip Repairs (supports BGA reballing for Huawei components)
• Multi-Brand Power IC and RAM Reballing (versatile use for power IC chips and RAM across iPhone, Huawei, Samsung, and Xiaomi devices)
• LCD Screen Repair Integration (used in LCD screen repair processes with steel mesh tin planting nets)

Package Contents:

• 1x RL-044 SAMEU4 RELIFE Precision BGA Stencils