T-type Solder Iron Tip with Blade for Remove Cell Phone Screen UV / LOCA Glue
The tool emerges as a slender, elongated attachment shaped in a “T” form, combining a flat blade with a tip designed to affix onto a compatible soldering iron. When heated, the blade becomes a controlled cutting and scraping edge, ideal for sliding beneath cured adhesive layers. There’s a certain balance in its design: rigid enough to lift or peel glue, yet precise enough to avoid damaging delicate components like LCDs, touch digitizers, or glass layers.
Once mounted and warmed, the heat transfers through the T-blade, softening or loosening the UV / LOCA glue. As the bond yields, the blade glides between layered materials—glass, frame, adhesive—enabling separation. The flat edge flushes against surfaces, preventing gouges or chips, while its thinness allows access to tight seams. Because it is relatively simple in shape, the user still guides it with care; movement must be steady to avoid scratching or cracking fragile screen elements.
Visually, the blade tip is compact, unadorned, functional. The metal holds a dull sheen, sometimes with slightly rounded edges softened from manufacture to avoid sharp burrs. The junction where blade meets tip is firm, often welded or securely fitted to resist wobble. Though not flashy, the tool’s appeal lies in its utility: delivering clean separations between glued layers, while keeping fragile display surfaces intact and ready for glue removal, cleaning, or further repair.
Features:
- UV Glue Clean Tool Remove Residue OCA LOCA Adhesive for Mobile Phone LCD Touch Screen Digitizer.
- The tool is suitable for iPhone/Samsung repair shop.
- It is used to refurbish LCD assembly with screen separator together.
- Compatible with most soldering iron handles that support interchangeable tips.
- Uniform Heat Distribution Ensures even heating across the blade for consistent glue removal.
- Made from durable, heat-resistant alloys to withstand high temperatures and ensure longevity.
- The T-type tip features a flat, blade-like shape that efficiently scrapes adhesive without damaging the screen or surrounding components.
Specifications:
- Material: Alloy steel with anti-corrosive coating.
- Shape: T-type flat blade.
- Shape Dimensions: 40mm(W) x 20mm(L)
- Temperature Range: up to 450°C.
Applications:
- Glue Removal: Effective for removing UV glue or LOCA glue used in bonding cell phone screens.
- Precision Cleaning: Useful for cleaning adhesive residue without harming delicate components.
- Screen Repairs: Essential for screen separation in smartphones, tablets, and other devices.
- Suitable for technicians and hobbyists working on electronic devices. and DIY Projects.
- Multi-Purpose Use: Can be used in other repair tasks requiring precision scraping.

Package Contents:
- 1x T-type Solder Iron Tip with Blade for Remove Cell Phone Screen UV / LOCA Glue





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