Universal A98 BGA Reballing Stencil Plate 39 in 1

Universal A98 BGA Reballing Stencil Plate 39 in 1

The Universal BGA Reballing Stencil Plate A98 (39 in 1) is a high-quality tool designed for reballing BGA (Ball Grid Array) chips in a variety of electronic devices. This stencil plate features 39 different patterns, making it highly versatile and suitable for a wide range of chip sizes, from small to large BGA chips.

Made from durable, heat-resistant stainless steel, the A98 stencil plate can withstand the high temperatures involved in the reballing process, ensuring that it remains in perfect condition over multiple uses. The precise cutouts in the stencil ensure accurate solder ball placement, essential for making reliable, high-quality solder joints that will hold up in demanding electronic applications.

Whether you’re working on smartphones, laptops, gaming consoles, or other consumer electronics, the A98 stencil plate allows for efficient and professional repairs. The stencil’s clear labeling makes it easy to choose the right pattern for each chip, streamlining the repair process and reducing the likelihood of errors.

Compatible with hot air rework stations and reballing machines, this stencil plate is suitable for use in both professional repair shops and by DIY enthusiasts looking to carry out precise reballing tasks. Its long-lasting durability and user-friendly design make it an essential tool for anyone involved in chip-level electronics repair.

Features: 

Specifications:

• Number of Stencil Patterns:
  39 patterns for various BGA chip sizes and pitches, providing versatility for a wide range of repair tasks.
• Material:
  High-Quality Stainless Steel Durable, heat-resistant stainless steel construction ensures long-lasting performance even under high temperatures during reballing processes.
• Temperature Resistance:
  The stencil can withstand high temperatures of up to 350°C (662°F), making it compatible with hot air rework stations and reballing machines.
• Accuracy:
  Precisely Cut Holes for exact ball placement, ensuring high-quality solder joints and reducing errors during BGA reballing.
• Compatibility:
  Works with a variety of BGA chip sizes and is ideal for use in repairing a broad range of electronics including smartphones, laptops, tablets, gaming consoles, and other consumer devices.
• Usage:
  Designed for use with hot air rework stations and reballing machines, ensuring consistent and accurate reballing.
• Reusability:
  Durable and Reusable – The stencil plate can be used multiple times without compromising its performance, making it cost-effective over time.

Applications:

• Smartphone Repairs
• Laptop and PC Repairs
• Gaming Consoles
• Electronics Prototyping and Repairs
• Training and Education

Benefits of Using the A98 Stencil Plate:

• Precision and Accuracy: Ensures that BGA chips are reflowed with accuracy, leading to stronger, more reliable solder joints.
• Cost-Effective: Instead of replacing entire circuit boards or chips, reballing is a more affordable way to repair and extend the lifespan of devices.
• Versatility: The 39 patterns provide compatibility with a wide range of BGA chip sizes and types, making it an all-in-one tool for various repair jobs.
• Professional Results: Whether you’re a hobbyist or a professional technician, the stencil plate delivers consistent, high-quality results, making your repairs look as good as new.

Package:

1x BGA Reballing Stencils for A98 MTK series