Universal BGA Reballing Stencil Plate 55 in 1

Universal BGA Reballing Stencil Plate 55 in 1

The Universal BGA Reballing Stencil 55 in 1 is a meticulously designed toolset tailored for professionals and hobbyists engaged in the intricate process of Ball Grid Array (BGA) reballing, particularly for mobile phone integrated circuit (IC) chip repairs. This comprehensive kit comprises 55 high-quality stencils, each crafted from durable stainless steel to ensure longevity and precision. The stencils are laser-cut to provide exceptional accuracy in aligning solder balls with the pin surfaces of BGA chips, facilitating reliable and efficient solder paste application. This extensive collection supports a wide variety of mobile phone models, making it an indispensable tool for electronics repair technicians.

Features:

• Includes 55 different stencil templates for versatile BGA reballing.
• Made from high-quality stainless steel for durability and resistance to heat.
• Compatible with a wide range of BGA ICs used in mobile phones and tablets.
• Precision-cut holes ensure accurate solder ball placement.
• Suitable for use with hot air rework stations and soldering irons.
• Facilitates efficient and accurate reballing processes.
• Compact and lightweight design for easy handling and storage.
• Reusable and easy to clean for multiple uses.

Specifications:

Applications:

• Reballing BGA ICs in mobile phone and tablet repairs.
• Solder ball placement for various BGA components.
• Rework and refurbishment of electronic devices.
• Precision soldering for professional technicians.
• Educational purposes for learning BGA reballing techniques.

Package Include:

1x Universal BGA Reballing Stencil Plate 55 in 1.