Tin Lead Solder Bar Sn63/Pb37 700gm

Tin Lead Solder Bar Type of Alloy:

Basic information of Tin Lead Solder Bar:

Size: 31.5cm x 2cm x 1.5cm

Color: Silver

Applications of Tin Lead Solder Bar:

1. For dip soldering or wave soldering of electronic products, such as PCBA
2. Assembly of Copper roofing, flashing, etc
3. Assembly of stained glass.
4. Other tinning purpose.

Features of Tin Lead-Free Solder Bar:

1. Eutectic alloy.
2. Bridge-free and icicle-free soldering.
3. Smooth, bright, well-formed fillets, free of gross micro-cracks, irrespective of the cooling rate.
4. Good through-hole penetration.
5. Good topside fillet formation.
6. Dross rate equal to or lower than tin-lead solder.
7. Does not require a nitrogen atmosphere.
8. Does not erode copper from holes, pads, and tracks.
9. The low rate of copper leaching makes it easy to control the copper content of the solder bath.
10. Lower aggressiveness to stainless steel and other solder pot materials as compared to tin-silver-copper alloys.
11. Thermal fatigue resistance and creep strength are better than tin-lead.
12. Slow, even growth of the intermetallic layer at the solder/substrate interface.
13. Also performs well in selective and dip soldering.