Precision Soldering Made Easy: MECHANIC XG-50 Solder Paste for Flawless Connections
Features:
- Alloy Composition: Sn63/Pb37, providing a eutectic mixture for reliable solder joints.
- Particle Size: Approximately 3 microns, ensuring smooth application and consistent soldering results.
- Flux Type: IPX3 flux, offering excellent wetting properties and minimal residue.
- Melting Point: 183°C, suitable for standard leaded soldering processes.
- Packaging: 35g container, ideal for prototyping and small-scale production.
Specifications:
- Model: XG-50
- Alloy: Sn63/Pb37
- Particle Size: 3 microns
- Flux Type: IPX3
- Melting Point: 183°C
- Weight: 35g
Applications:
- SMD Component Soldering: Ideal for soldering small SMD components in reflow ovens or with hot air soldering stations.
- Prototyping: Suitable for prototype development and small-scale production runs.
- Repair and Rework: Effective for repairing and reworking PCBs, especially in BGA and fine-pitch component areas.
Warning:
- Harmful by inhalation and if swallowed.
- The danger of cumulative effects.
- Keep away from food, drink, and animal feeding stuff.
- When using do not eat, Drink, or smoke.
- Avoid prolonged or repeated contact with any skin with solder paste. In case of solder paste ingestion see a doctor immediately.
- Store the container well closed and cool.
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