Feature:
- HIGH PERFORMANCE: Environmentally friendly soldering paste, which is easy to tin, no , with high insulation resistance.
- FOR PACKAGE WORKS: Can be used for rework, BGA, PGA and CSP package pin connections, such as flipping chips to PWB substrates.
- GOOD ADHESION: The solder paste has excellent solder adhesion, resistance, and is suitable for multi PCB reflow soldering.
- PORTABLE DESIGN: With a capacity of 100g/3.5oz, has compact structure, easy to use and carry, and strong practicability.
- WIDE APPLICATION: Used for soldering of sensors, wires, connecting tubes, BGA chips, etc., convenient and efficient.
Specifications:
- Flux Type: AD-559
- Material: the mixture of high-quality alloyed powder and rosin paste flux, it can avoid the pale yellow residue.
- Weight: 100g
- Advantage: Good immersion and high intensity joint.
- Function: for BGA , PGA Reworking, PCB Work.
- Easy to tin.
- less residue.
- Insulated: Yes
- Color: off white
- Dimensions: 80mm x 60mm
Application:
for soldering and reballing of computer and phone chips. PC card. electronic chip-level flux soldering
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