RL-044 RELIFE Precision BGA Stencils
The RL-044 RELIFE Precision BGA Stencils are professional-grade tools designed for reballing and repairing Ball Grid Array (BGA) components. These stencils are precision-engineered to cater to a wide range of BGA layouts, ensuring accurate alignment and efficient soldering. Constructed from high-quality stainless steel, they are ideal for both repair technicians and electronics enthusiasts looking for reliable, reusable, and versatile solutions for BGA rework.
Features:
- High Precision Design where Laser-cut apertures for precise solder paste application and perfect chip alignment.
- Durable Material where crafted from stainless steel for enhanced durability and heat resistance.
- Multiple Layouts where accommodates a variety of BGA chip configurations, making it suitable for a range of devices.
- Heat Resistant where withstands high soldering temperatures without deformation.
- Lightweight and Compact where easy to handle and store, perfect for on-the-go technicians.
- Designed for repeated use, providing long-term cost efficiency.
- Polished Surface where smooth finish ensures effortless cleaning and prevents damage to components.
- Universal Application where compatible with CPUs, GPUs, ICs, and other BGA chips.
Specifications:
- Brand: RELIFE.
- Model: RL-044
- Material: Stainless steel
- Number of Layouts: 16
- Thickness(Approx.): 0.1 mm
- Hole Accuracy: ±0.01 mm
- Standard Size Dimensions(L x W): 10 cm x 8 cm
- Package Size(L x W): 130 mm x 120 mm
- Surface Finish: Polished and heat-treated for enhanced durability
Applications:
- Chip Reballing.
- Electronics Repair.
- PCB Maintenance.
- Prototype Testing.
- Education and Training.
- DIY Electronics Projects.
Package Contents:
- 1x RL-044 RELIFE Precision BGA Stencils
