Universal BGA Reballing Stencil Plate 53 in 1
The Universal BGA Stencil Plate is a versatile tool designed for repairing and reballing Ball Grid Array (BGA) components. This stencil plate combines 53 different BGA layouts in a single sheet, making it suitable for a wide range of chip sizes and configurations. Its high-precision design ensures consistent alignment and reliable soldering results, ideal for professionals and DIY enthusiasts in the electronics repair industry.
Features:
- 53 Layouts in One Plate where accommodates various BGA chip sizes and patterns, enhancing its utility and compatibility.
- Durable Material where made from high-quality stainless steel for long-lasting performance and resistance to heat and wear.
- High Precision where laser-cut holes for accurate solder paste application and reballing.
- Compact Design where lightweight and portable, making it easy to integrate into repair toolkits.
- Universal Compatibility where supports a wide range of chip manufacturers and configurations.
- Designed for multiple uses, ensuring cost-effectiveness.
- Heat-Resistant where withstands high soldering temperatures without deformation.
Specifications:
| Parameter | Value |
|---|---|
| Item Type: | BGA Reballing Stencil Plate |
| Material: | Stainless Steel |
| Color: | Silver |
| Finish: | Polished for smooth handling and durability |
| Number of Layouts: | 53 |
| Thickness (Approx.): | 0.1 mm |
| Standard Size Dimensions (L × W): | 19.5 cm × 9.5 cm |
| Hole Accuracy: | ±0.01 mm |
| Compatibility: | Suitable for ICs, CPUs, GPUs, and other BGA components |
Applications:
- Electronics Repair.
- Chip Reballing.
- Prototype Development.
- Training and Education.
- DIY Electronics Projects.
Package Contents:
- 1x Universal Stencil BGA Reballing Plate 53 in 1
