4816P-AGC-272 SMD BUSSED RESISTOR NETWORKS 2.7KΩ SOIC-16
The 4816P-AGC-272 is a surface-mount bussed resistor network featuring multiple 2.7kΩ thick-film resistors integrated into a compact SOIC-16 package. This resistor array is designed to reduce PCB space usage, simplify assembly, and minimize the number of discrete resistor components required in digital and embedded electronic systems. The bussed configuration connects one side of all resistor elements to a common pin, making the device suitable for pull-up, pull-down, line termination, and signal conditioning applications.
Features:
- Bussed schematic with 8 resistors arranged in 4 pairs.
- Medium body SOIC package for compact SMT designs.
- Reflow solderable for modern assembly processes.
- Compatible with automatic surface mounting equipment.
- Thick film resistive elements for stable performance.
- Low temperature coefficient of ±100ppm/°C.
- Excellent TCR tracking of ±50ppm/°C maximum.
Specifications:
| Parameter | Value |
|---|---|
| Type | Thick Film Resistor Network |
| Schematic | Bussed (2 Circuit) |
| Number of Resistors | 8 (arranged in 4 bussed pairs) |
| Resistance Value | 2.7KΩ (2,700Ω) |
| Tolerance | ±2% (Standard), ±1% (F) and ±0.5% (D) available |
| Power Rating per Element | 0.16W at +70°C |
| Package Power Rating (Max at +70°C) | 1.28W |
| Temperature Coefficient (TCR) | ±100ppm/°C (50Ω and above) |
| TCR Tracking | ±50ppm/°C maximum |
| Maximum Operating Voltage | 50V |
| Operating Temperature Range | -55°C to +125°C |
| Storage Temperature Range | -55°C to +150°C |
| Insulation Resistance | >10,000MΩ minimum |
| Dielectric Withstanding Voltage | 200VRMS |
| Lead Coplanarity | 0.102mm (0.004″) max. at mounting |
| Flammability | UL94V-0 |
| Lead Frame Material | Copper, solder coated |
| Body Material | Thermoplastic |
| Package Type | SOIC-16 (Small Outline Integrated Circuit) |
| Pin Count | 16 |
| Mounting Style | Surface Mount (SMD) |
Applications:
- Digital logic pull-up and pull-down networks.
- Open collector pull-up circuits.
- Wired OR pull-up configurations.
- Line termination networks.
- Long-line impedance balancing.
- Power driven pull-up applications.
- TTL input pull-down networks.
- DRAM applications.
- SCSI applications.
Package Include:
1x 4816P-AGC-272 SMD BUSSED RESISTOR NETWORKS 2.7KΩ SOIC-16