Lanrui G4 Rotate Magnetic Adsorption Explosion-Proof Delaminator for Motherboard Layering

Lanrui G4 Rotate Magnetic Adsorption Explosion-Proof Delaminator for Motherboard Layering

The Lanrui G4 Delaminator is a specialized repair tool designed for mobile phone motherboard (PCB) layer separation, especially in modern dual-layer or stacked boards. It features a strong magnetic adsorption head that securely grips the board, allowing technicians to carefully separate layers without slipping or damaging delicate components. This makes it highly useful in advanced repairs such as CPU rework, baseband repair, and board-level troubleshooting.

One of its key advantages is the explosion-proof design, which enhances safety during high-temperature operations where solder and internal layers may expand or react unpredictably. The tool also supports up to 340° rotation, giving precise control over angle and pressure while working. Combined with its ergonomic metal handle, the Lanrui G4 improves accuracy, reduces motherboard deformation, and simplifies delicate separation tasks—even for beginners.

Features:

• Strong magnetic adsorption head for secure grip.
• Explosion-proof design for safer high-temperature work.
• 340° rotating head for flexible positioning.
• Helps prevent motherboard deformation during separation.
• Improves precision in layered PCB repair.
• Durable all-metal construction.
• Ergonomic, non-slip handle.
• Suitable for beginners and professionals.
• Designed for delicate mobile motherboard operations.

Specifications:

Applications:

• Mobile phone motherboard repair (iPhone, Android).
• PCB layer separation (stacked boards).
• CPU / IC rework preparation.
• Micro-soldering and board-level repair.
• Laptop motherboard repair (advanced cases).

Package Includes:

• 1x Lanrui G4 Rotate Magnetic Adsorption Explosion-Proof Delaminator for Motherboard Layering.