MDP16-1-221 BUSSED RESISTOR NETWORKS 220Ω DIP-16
The MDP16-1-221 is a thick film bussed resistor network manufactured by BI Technologies (TT Electronics), housed in a rugged 16-pin molded DIP package. This reliable resistor network provides 15 nominally equal 220Ω resistors, each connected between a common pin and discrete individual pins.
The 898 series is engineered with thick film resistive elements and offers stable performance characteristics, making it an ideal choice for engineers and hobbyists working on digital logic pull-up/pull-down applications, open collector configurations, and wired-OR circuits. Its compact design and compatibility with automatic insertion equipment reduce total assembly costs while ensuring consistent performance across all elements. The device meets MIL-R-83401 environmental specifications for high reliability applications.
Features:
- Bussed schematic with 15 resistors and one common pin.
- Rugged molded DIP construction for durability.
- Thick film resistive elements for stable performance.
- Meets MIL-R-83401 environmental specifications.
- Reduces total assembly costs with integrated network design.
- Compatible with automatic inserting equipment.
- Wide resistance range availability.
- Uniform performance characteristics across all elements.
- Standard magazine packaging for easy handling.
Specifications:
| Parameter | Value |
|---|---|
| Type | Thick Film Resistor Network |
| Schematic | Bussed (-1 Circuit) |
| Number of Resistors | 15 |
| Resistance Value | 220Ω |
| Tolerance | ±2% (Standard), ±1% (F) available |
| Power Rating per Element | 0.125W at +70°C |
| Package Power Rating (Max at +70°C) | 2.25W |
| Temperature Coefficient (TCR) | ±100ppm/°C typical |
| Maximum Operating Voltage | 100V |
| Operating Temperature Range | -55°C to +125°C |
| Storage Temperature Range | -55°C to +150°C |
| Insulation Resistance | >10,000MΩ minimum |
| Dielectric Withstanding Voltage | 200VRMS |
| Package Type | DIP-16 (Dual-In-Line) |
| Pin Count | 16 |
| Lead Frame Material | Copper alloy, solder plated |
| Body Material | Molded epoxy |
| Mounting Style | Through-Hole |
Applications:
- MOS/ROM pull-up and pull-down networks.
- Open collector pull-up circuits.
- Wired OR pull-up configurations.
- Power driven pull-up applications.
- TTL input pull-down networks.
- Digital pulse squaring circuits.
- TTL unused gate pull-up configurations.
- High speed parallel pull-up applications.
Package Include:
1x MDP16-1-221 BUSSED RESISTOR NETWORKS 220Ω DIP-16