MDP16-1-330 BUSSED RESISTOR NETWORKS 330 Ohm DIP-16
The MDP16-1-330 is a bussed resistor network array featuring multiple 330Ω thick-film resistors integrated into a compact DIP-16 package. This resistor network is designed to simplify PCB layouts, reduce component count, and improve assembly efficiency in digital and electronic circuits. The integrated bussed configuration connects one side of all resistors to a common pin, making the device ideal for pull-up, pull-down, line termination, and logic interface applications.
Features:
- Bussed schematic with 15 resistors and one common pin.
- 0.160″ (4.06mm) maximum seated height for compact designs.
- Rugged molded case construction for durability.
- Thick film resistive elements for stable performance.
- Low temperature coefficient of ±100ppm/°C.
- Excellent tracking of ±50ppm/°C between resistors.
- Reduces total assembly costs with integrated network design.
- Compatible with automatic inserting equipment.
- Wide resistance range availability from 10Ω to 2.2MΩ.
- Uniform performance characteristics across all elements.
Specifications:
| Parameter | Value |
|---|---|
| Type | Thick Film Resistor Network |
| Schematic | Bussed (01) |
| Number of Resistors | 15 |
| Resistance Value | 330Ω |
| Tolerance | ±2% (Standard), ±1% and ±5% available |
| Power Rating per Element | 0.125W at +70°C |
| Package Power Rating (Max at +70°C) | 1.92W |
| Temperature Coefficient (TCR) | ±100ppm/°C (-55°C to +125°C) |
| Tracking | ±50ppm/°C (-55°C to +125°C) |
| Operating Temperature Range | -55°C to +125°C |
| Storage Temperature Range | -55°C to +150°C |
| Voltage Coefficient of Resistance | <50ppm typical |
| Dielectric Strength | 200VAC |
| Insulation Resistance | >10,000MΩ minimum |
| Package Type | DIP-16 (Dual-In-Line) |
| Pin Count | 16 |
| Seated Height | 0.160″ (4.06mm) maximum |
| Weight | 1.5g |
| Mounting Style | Through-Hole |
Applications
- MOS/ROM pull-up and pull-down networks.
- Open collector pull-up circuits.
- Wired OR pull-up configurations.
- Power driven pull-up applications.
- TTL input pull-down networks.
- Digital pulse squaring circuits.
- TTL unused gate pull-up configurations.
- High speed parallel pull-up applications.
Package Include:
1x MDP16-1-330 BUSSED RESISTOR NETWORKS 330 Ohm DIP-16