MDP16-1-562 BUSSED RESISTOR NETWORKS 5.6KΩ DIP-16
The MDP16-1-562 is a bussed resistor network array featuring multiple 5.6kΩ thick-film resistors integrated into a compact DIP-16 through-hole package. This resistor network is designed to reduce PCB space usage, simplify circuit assembly, and minimize the number of discrete resistor components required in digital and embedded electronic systems. The bussed configuration connects one side of all resistor elements to a common pin, making the device suitable for pull-up, pull-down, signal conditioning, and line termination applications.
Features:
- Bussed schematic with 15 resistors and one common pin.
- 0.160″ (4.06mm) maximum seated height for compact designs.
- Rugged molded case construction for durability.
- Thick film resistive elements for stable performance.
- Low temperature coefficient of ±100ppm/°C.
Specifications:
| Type | Thick Film Resistor Network |
| Schematic | Bussed (01) |
| Number of Resistors | 15 |
| Resistance Value | 5.6KΩ (5,600Ω) |
| Tolerance | ±2% (Standard), ±1% and ±5% available |
| Power Rating per Element | 0.125W at +70°C |
| Package Power Rating (Max at +70°C) | 1.92W |
| Temperature Coefficient (TCR) | ±100ppm/°C (-55°C to +125°C) |
| TC Tracking | ±50ppm/°C (-55°C to +125°C) |
| Maximum Operating Voltage | 100V |
| Operating Temperature Range | -55°C to +125°C |
| Storage Temperature Range | -55°C to +150°C |
| Insulation Resistance | >10,000MΩ minimum |
| Dielectric Withstanding Voltage | 200VRMS |
| Package Type | DIP-16 (Dual-In-Line) |
| Pin Count | 16 |
| Terminals | Solder plated leads |
| Mounting Style | Through-Hole |
Applications:
- MOS/ROM pull-up and pull-down networks.
- Open collector pull-up circuits.
- Wired OR pull-up configurations.
- Power driven pull-up applications.
- TTL input pull-down networks.
- Digital pulse squaring circuits.
- TTL unused gate pull-up configurations.
- High speed parallel pull-up applications.
Package Include:
1x MDP16-1-562 BUSSED RESISTOR NETWORKS 5.6KΩ DIP-16
