MECHANIC Solder Paste XGSP30 20gm 183°C
The MECHANIC Solder Paste XGSP30 20gm 183°C is a professional-grade soldering material engineered for high-precision electronic assembly and repair tasks. Formulated with a eutectic alloy composition of 63% tin (Sn) and 37% lead (Pb), this solder paste provides a stable and reliable melting point at 183°C, ensuring consistent performance during reflow and manual soldering processes
Features:
- Eutectic Sn63/Pb37 alloy composition for precise and consistent melting performance.
- Stable melting point of 183°C for reliable reflow soldering.
- Smooth paste consistency for accurate and controlled application.
- Excellent wetting capability for strong and uniform solder joints.
- Low-residue, no-clean formulation for improved efficiency.
Specifications:
| Parameter | Value |
|---|---|
| Model | XGSP30 |
| Alloy Composition | Sn 63% / Pb 37% |
| Melting Point | 183°C |
| Particle Size | 20-38 μm |
| Type | Leaded solder paste |
| Content | 20 g |
Applications:
- SMD component soldering and rework.
- BGA reballing and repair processes.
- Mobile phone and tablet motherboard repair.
- PCB assembly and prototyping.
- Consumer electronics maintenance.
- Precision electronic circuit repairs.
Package Include:
1x MECHANIC Solder Paste XGSP-30 20gm 183°C
