Sn62Pb36Ag2 Mid-Temperature Leaded Silver-Bearing Solder Paste 500g
Sn62Pb36Ag2 Mid-Temperature Leaded Silver-Bearing Solder Paste is a ready-to-use soldering material formulated for dependable electronic assembly. It combines finely divided solder alloy with a flux medium, allowing the material to be deposited accurately onto PCB pads before components are positioned. During heating, the paste activates, wets prepared metal surfaces, and forms permanent conductive joints between components and circuit-board tracks.
The alloy contains tin, lead, and silver in a eutectic composition that changes from solid to liquid at a single melting temperature. This predictable transition supports controlled reflow processing and reduces the prolonged semi-molten stage associated with non-eutectic alloys. The silver-bearing formulation is commonly selected where stable joint formation, consistent wetting, and reliable bonding are important during surface-mount production or detailed electronic repair.
Features:
- Eutectic Sn62Pb36Ag2 silver-bearing solder alloy.
- Sharp and predictable melting transition.
- Good wetting and fluidity during soldering.
- Produces strong and reliable electrical joints.
- Suitable for leaded SMT and SMD assembly processes.
- Compatible with stencil printing and suitable dispensing methods.
- Suitable for manual and automated solder-paste printing.
- Silver-bearing composition for dependable joint formation.
- Large 500g pack suitable for regular workshop or production use.
- Suitable for professional electronics manufacturing and repair work.
Specifications:
| Specification | Details |
|---|---|
| Product Type: | Leaded silver-bearing solder paste |
| Alloy Designation: | Sn62Pb36Ag2 |
| Tin Content: | 62% |
| Lead Content: | 36% |
| Silver Content: | 2% |
| Alloy Type: | Eutectic |
| Melting Point: | 179°C |
| Melting Point in Fahrenheit: | 354°F |
| Temperature Classification: | Mid-temperature |
| Physical Form: | Paste |
| Primary Soldering Process: | SMT/SMD reflow soldering |
| Application Method: | Stencil printing or compatible dispensing equipment |
| Lead-Free: | No |
| Net Weight: | 500g |
Applications:
- SMT PCB Assembly.
- SMD Component Soldering.
- Reflow Soldering.
- PCB Stencil Printing.
- Electronic Circuit Prototyping.
- PCB Repair and Rework.
- Manual Electronics Assembly.
- Small-Batch PCB Production.
- Industrial Electronics Manufacturing.
- Electronics Workshop Soldering.
Package Contents:
- 1x Sn62Pb36Ag2 Mid-Temperature Leaded Silver-Bearing Solder Paste 500g