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Soldering Tin Paste

Soldering tin paste is a mixture of solder alloy and flux used to join electronic components to PCBs, ensuring reliable, precise, and efficient soldering.

12.00 EGP

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Availability: In Stock
SKU:300000010193

Soldering tin paste is a mixture of powdered solder alloy and flux, designed to provide strong and reliable solder joints for electronic and electrical applications. It ensures efficient heat transfer, excellent wetting properties, and minimal residue after soldering. The paste is commonly used in surface mount technology (SMT), rework, and repair processes.

Features:
  • Solder paste allows for controlled and precise placement of solder on the PCB, which is especially important for small and densely-packed components.
  • The flux in the paste helps clean the surfaces, ensuring a strong, reliable electrical connection between components and the PCB.
  • Solder paste offers a more uniform heating process compared to other methods, reducing the likelihood of damage to sensitive components.
  • Lead-free solder pastes are available, supporting compliance with environmental standards like RoHS (Restriction of Hazardous Substances).
  • It is easier to work with than traditional soldering wires or bars, making it ideal for automated processes.
  • Soldering paste is often more cost-effective for high-volume production compared to other soldering methods.
  • Solder pastes are generally composed of a metal alloy such as Sn (tin), Ag (silver), Cu (copper), and/or Pb (lead). Lead-free options are often based on alloys like SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
  • The paste has a specific viscosity that allows for easy application through stencils or syringes.
  • Flux is included in the paste to help remove oxidation from surfaces and improve the flow of solder.
  • The paste is formulated to melt at specific temperatures, typically around 183°C (for lead-free) or 183–190°C (for leaded solder) during the reflow soldering process.
  • Lead-free solder pastes have a melting point around 217–220°C.
  • Leaded pastes melt at approximately 183°C.
  • No-clean or Water-soluble Flux.
Applications:
  • Surface-Mount Technology (SMT).
  • PCB Assembly.
  • Rework and Repair.
  • Prototype Development.
  • Automotive Electronics.
  • Consumer Electronics.
  • Medical Devices.
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