Universal BGA Reballing Stencil Plate 53 in 1

Universal BGA Reballing Stencil Plate 53 in 1

The Universal BGA Stencil Plate is a versatile tool designed for repairing and reballing Ball Grid Array (BGA) components. This stencil plate combines 53 different BGA layouts in a single sheet, making it suitable for a wide range of chip sizes and configurations. Its high-precision design ensures consistent alignment and reliable soldering results, ideal for professionals and DIY enthusiasts in the electronics repair industry.

Features:

• 53 Layouts in One Plate where accommodates various BGA chip sizes and patterns, enhancing its utility and compatibility.
• Durable Material where made from high-quality stainless steel for long-lasting performance and resistance to heat and wear.
• High Precision where laser-cut holes for accurate solder paste application and reballing.
• Compact Design where lightweight and portable, making it easy to integrate into repair toolkits.
• Universal Compatibility where supports a wide range of chip manufacturers and configurations.
• Designed for multiple uses, ensuring cost-effectiveness.
• Heat-Resistant where withstands high soldering temperatures without deformation.

Specifications:

• Item Type: BGA Reballing Stencil Plate
• Material: Stainless steel
• Color: Silver
• Finish: Polished for smooth handling and durability
• Number of Layouts: 53
• Thickness(Approx.): 0.1 mm
• Standard Size Dimensions(L x W): 19.5 cm x 9.5 cm
• Hole Accuracy: ±0.01 mm
• Compatibility: Suitable for ICs, CPUs, GPUs, and other BGA components

Applications:

• Electronics Repair.
• Chip Reballing.
• Prototype Development.
• Training and Education.
• DIY Electronics Projects.