Features:
- Heat conductive double-sided adhesive is made of acrylic polymer filled with heat conductive ceramic powder and organic silica gel adhesive.
- It has the characteristics of high thermal conductivity and insulation, and has softness, compressibility, fit and strong viscosity.
- It is suitable for a wide temperature range, can fill the uneven surface, can closely and firmly fit the heat source device and heat sink, and quickly conduct the heat out.
- The performance of thermal conductivity, insulation, buffer and high tacky make it as the best choice for electronic application.
- Working temperature 80-120°C. Flexible and conformable. Ideal for uneven surfaces.
- With good viscidity, can put the heating element and radiator together, as a whole, enhance the cooling effect.
Specifications:
- Dimensions: 18 mm(w) x 25 m (L) x 0.1 mm (thickness(Approx)).
- High thermal conductivity
- strong insulation
- strong viscosity.
- pressure-resistant.
- double conductive tape.
Application:
- For CPU, LED,PPR heat sink, microprocessor
- For any power consumption semiconductor
- Replacing screws, fasteners and other fixed means
- Fixing heat sink on the power supply circuit board
- Fixing heat sink on vehicle control circuit board
- Fixing heat sink on packaged chips
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