August 9, 2025 0 In New posts

Ai-Thinker Bluetooth Module Comparison: PB-03F vs PB-03 vs PB-03M

Ai-Thinker

Contents

 

Introduction

 

PB-03 series (PB-03, PB-03M & PB-03F)is a BLE module developed by Shenzhen Ai-Thinker Technology Co.,Ltd.The core processor chip PHY6252(SSOP24)of this module is a BLE SoC with high integration and low power consumption, which is specially designed for various applications such as IoT, mobile devices, wearable electronic devices and smart homes.

PHY6252(SSOP24)chip has industry-leading low power consumption performance and RF performance,it supports BLE 5.2.The chip built in 64 KB SRAM,256KB flash,96 KB ROM,256bit efuse.The chip supports a variety of low-power working states and can meet the power consumption requirements of various application scenarios.RF output power can be adjusted to achieve the best balance among communication distance,communication rate and power consumption.

Core Similarities Across All Models

 

  • Core Chip: PHY6252 (SSOP24) BLE SoC

  • Bluetooth Version: BLE 5.2 with mesh support

  • Memory: 64KB SRAM, 256KB flash, 96KB ROM

  • Security: AES-128 hardware encryption

  • Power Requirements: 2.7-3.6V, >200mA current

  • Operating Temp: -40°C to +85°C

  • RF Performance:

    • TX Power: Up to +10dBm

    • RX Sensitivity: -93dBm (2Mbps) to -102dBm (125Kbps)

    • Frequency Range: 2400-2483.5MHz

Key Differences Summary

 

Feature PB-03F (SMD) PB-03 (SMD) PB-03M (DIP)
Package Type SMD-22 SMD-61 DIP-18 Gold finger
Dimensions 24×16×3.1mm 16.6×13.2×2.8mm 18×18×2.8mm
IO Count 19 available GPIOs 19 available GPIOs 15 available GPIOs
Pin Count 22 pins 61 pins 22 pins
Antenna Gain 1.38-2.15dBi 1.63-2.06dBi 0.94-1.86dBi
Antenna Eff. 66.53-81.08% 54.62-61.27% 49.69-59.47%
Packaging 800pcs/reel 900pcs/reel 800pcs/reel
Special Features Best antenna performance Most compact design Easiest prototyping
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Detailed Comparison

 

PB-03F Advantages

  • Best RF Performance: Highest antenna efficiency (up to 81.08%) and gain

  • Balanced Design: Good mix of size (24×16mm) and IO count (19 GPIOs)

  • SMD Reliability: Robust surface-mount package for production

PB-03 Advantages

  • Most Compact: Smallest footprint (16.6×13.2mm)

  • High Integration: 61-pin package with full feature access

  • Cost-Effective: Higher reel capacity (900pcs)

PB-03M Advantages

  • Prototyping Friendly: Through-hole DIP package

  • Gold Contacts: Durable for repeated insertions

  • Simpler Assembly: No reflow soldering needed

Shared Design Requirements

 

  • Power Supply: Need LDO/DC-DC with <30mV ripple

  • Antenna Placement: Must be at board edge with clearance

  • ESD Protection: Required for all I/O and power lines

  • Level Shifting: Needed for 3.3V interfaces

Recommended Applications

 

  • PB-03F: High-performance IoT devices, industrial sensors

  • PB-03: Space-constrained wearables, compact consumer electronics

  • PB-03M: Development boards, educational kits, quick prototypes

All models offer the same ultra-low power consumption (<1μA deep sleep) and support BLE 5.2 mesh networking. The choice depends on your:

  1. Size constraints

  2. Production volume

  3. RF performance needs

  4. Development stage (prototyping vs mass production)

For highest performance: Choose PB-03F
For smallest size: Choose PB-03
For easiest development: Choose PB-03M

 

External Resources

 

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