Product Description

RELIFE RL-404 solder paste is a special type of low-melting solder paste (tin in the form of a paste) intended for soldering electronic components, i.e. SMD, BGA, e.g. in repair processes.

Thanks to the very low melting point of exactly 138 ° C, the use of the paste in this process allows you to perform complex repairs (e.g. replacing the CPU in the iPhone) without exposing other phone components to damage.

Features:

A low-temperature lead-free solder paste customized for high-end motherboard repair
Tin lighting/climbing tin strong/high purity/temperature standard / easy to store
Low-temperature tin paste melting point temperature
Low melting point
Effective protection of circuit board components
Backed by value tin technology