Repairing BGA Chipset Solder Balls for PCs, Laptops and Smartphones.
Features
- Quick repairing of oxidized solder balls for chipset without lifting.
- Fast reflow and evenly spread under BGA chipset.
- High quality and activity.
- Not corrosive and easy cleaning.
For Using
- Put a little bit of Flux.
- Use only hot air soldering station for SMT ICs rework.
- Use any solvent such as, thinner or any alcohol for cleaning.
Safety Precautions:
- Close After Using.
- Keep Away from Children.
Appearance:
The flux is a yellow liquid, packaged in a transparent plastic bottle, capacity 50ml.
