HC-131 Heatsink Thermal Compound Paste
The HC-131 Heatsink Thermal Compound Paste 15g is a white thermal interface compound designed to improve heat transfer between heat-generating electronic components and their heatsinks. It fills microscopic air gaps and surface irregularities between mating surfaces, helping establish a more efficient thermal path from the component to the heatsink.
Features:
- White thermal interface compound for electronic cooling applications.
- 1.93W/m·K published thermal conductivity.
- 0.225°C·in²/W published thermal resistance.
- Designed to improve thermal transfer between components and heatsinks.
- Helps fill microscopic air gaps and surface irregularities.
- Electrically insulating thermal compound.
Specifications:
| Parameter | Value |
|---|---|
| Model | HC-131 |
| Product Type | Heatsink Thermal Compound |
| Compound Type | Silicone Thermal Paste |
| Color | White |
| Thermal Conductivity | 1.93W/m·K |
| Thermal Resistance | 0.225°C·in²/W |
| Electrical Resistivity | 5.0×10¹⁵Ω·cm |
| Operating Temperature | -50°C to +200°C |
| Thermal Interface | Component to Heatsink |
| Electrical Property | Electrically Insulating |
| Net Weight | 15g |
Applications:
- CPU and processor heatsink applications.
- GPU and graphics processor cooling.
- MOSFET thermal management.
- IGBT thermal management.
- Power transistor cooling.
- Voltage regulator cooling.
- Rectifier and power semiconductor cooling.
- High-power LED thermal management.
- Power supply thermal management.
- Audio amplifier cooling.
- Industrial electronic equipment.
- Electronic repair and maintenance.
Package Include:
1x HC-131 Heatsink Thermal Compound Paste.
