Home
Shop

IRFD010 N-Channel HEXFET Power MOSFET 50V 1.7A DIP-4

FD010 N-Channel 50V 1.7A Power MOSFET. Low on-resistance and fast switching in a compact 4-pin DIP package.

75.00 EGP

Buy Now
Availability: In Stock
SKU:34963001525210
IRFD010 N-Channel HEXFET Power MOSFET 50V 1.7A DIP-4

The IRFD010 leverages advanced HEXFET technology to achieve very low on-state resistance combined with high transconductance and great device ruggedness. It inherits all the core advantages of standard MOSFETs, including simple voltage control, ultra-fast switching, ease of paralleling, and highly stable electrical parameters across temperature variations.

Features
  • Optimized for Automatic Insertion
  • Space-Saving Design
  • High Efficiency
  • Design Flexibility
  • Robust Performance
Specifications
Absolute Maximum Ratings
Symbol Parameter Value Units / Conditions
VDS Drain Source Voltage 50 V
VDGR Drain Gate Voltage (RGS = 20 kΩ) 50 V
ID @ 25°C Continuous Drain Current 1.7 A, TC = 25°C
ID @ 100°C Continuous Drain Current 1.1 A, TC = 100°C
IDM Pulsed Drain Current 11 A
VGS Gate Source Voltage ±20 V
PD @ 25°C Max. Power Dissipation 1 W, TC = 25°C
Linear Derating Factor 0.0082 W/K (W/°C)
ILM Inductive Current, Clamped 14 A, L = 100 μH
IL Unclamped Inductive Current (Avalanche Current) 1.5 A
TJ, Tstg Operating Junction and Storage Temperature Range -55 to 150 °C
Lead Temperature (Soldering) 300 °C, 1.6mm from case for 10s
Electrical Characteristics (@ TC = 25°C)
Symbol Parameter Min Typ Max Units
BVDSS Drain Source Breakdown Voltage 50 V (VGS = 0V, ID = 250 μA)
VGS(th) Gate Threshold Voltage 2.0 4.0 V (VDS = VGS, ID = 250 μA)
IGSS Gate-Source Leakage Forward 500 nA (VGS = 20V)
IGSS Gate-Source Leakage Reverse -500 nA (VGS = -20V)
IDSS Zero Gate Voltage Drain Current 250 μA (VDS = Max Rating, VGS = 0V)
IDSS High Temp. Zero Gate Voltage Drain Current 1000 μA (0.8 × Max VDS, VGS = 0V, TC = 125°C)
ID(on) On-State Drain Current 1.7 A (VDS > ID(on) × RDS(on)max, VGS = 10V)
RDS(on) Static Drain-Source On-State Resistance 0.16 0.20 Ω (VGS = 10V, ID = 0.88A)
gfs Forward Transconductance 2.1 3.2 S (VDS = 2 × VGS, IDS = 3.6A)
Dynamic, Switching & Thermal Characteristics
Symbol Parameter Min Typ Max Units
Ciss Input Capacitance 250 pF (VGS = 0V, VDS = 25V, f = 1.0 MHz)
Coss Output Capacitance 150 pF
Crss Reverse Transfer Capacitance 29 pF
td(on) Turn-On Delay Time 11 17 ns (VDD = 25V, ID = 7.2A, RG = 25Ω, RD = 3.3Ω)
tr Rise Time 33 50 ns
td(off) Turn-Off Delay Time 12 18 ns
tf Fall Time 23 35 ns
Qg Total Gate Charge 8.8 13 nC (VGS = 10V, ID = 7.2A Max Rating)
Qgs Gate-Source Charge 2.2 3.3 nC
Qgd Gate-Drain (“Miller”) Charge 2.6 3.9 nC
LD Internal Drain Inductance 4.0 nH (6mm from package to center of die)
LS Internal Source Inductance 6.0 nH (6mm from package to source bonding pad)
RthJA Thermal Resistance, Junction-to-Ambient 120 K/W (Typical socket mount)
Source-Drain Diode Ratings & Characteristics
Symbol Parameter Min Typ Max Units
IS Continuous Source Current (Body Diode) 1.7 A
ISM Pulse Source Current (Body Diode) 14 A
VSD Diode Forward Voltage 1.6 V (TJ = 25°C, IS = 1.7A, VGS = 0V)
trr Reverse Recovery Time 41 86 190 ns (TJ = 25°C, IF = 7.2A, dIF/dt = 100A/μs)
QRR Reverse Recovered Charge 0.15 0.33 0.78 μC

Applications
  • Computer mainboards and peripheral circuit boards.
  • Printers and office automation equipment.
  • Telecommunications infrastructure and networking hardware.
  • Consumer electronics and general-purpose power switching products.
Package Content
  • 1 x IRFD010 N-Channel HEXFET Power MOSFET 50V 1.7A DIP-4
DataSheet
Back to Top
Product has been added to your cart