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IRFD010 N-Channel HEXFET Power MOSFET 50V 1.7A DIP-4

FD010 N-Channel 50V 1.7A Power MOSFET. Low on-resistance and fast switching in a compact 4-pin DIP package.

75.00 EGP

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Availability: In Stock
SKU:34963001525210
IRFD010 N-Channel HEXFET Power MOSFET 50V 1.7A DIP-4

The IRFD010 leverages advanced HEXFET technology to achieve very low on-state resistance combined with high transconductance and great device ruggedness. It inherits all the core advantages of standard MOSFETs, including simple voltage control, ultra-fast switching, ease of paralleling, and highly stable electrical parameters across temperature variations.

Features
  • Optimized for Automatic Insertion
  • Space-Saving Design
  • High Efficiency
  • Design Flexibility
  • Robust Performance
Specifications
Absolute Maximum Ratings
Symbol Parameter Value Units / Conditions
VDS Drain Source Voltage 50 V
VDGR Drain Gate Voltage (RGS = 20 kΩ) 50 V
ID @ 25°C Continuous Drain Current 1.7 A, TC = 25°C
ID @ 100°C Continuous Drain Current 1.1 A, TC = 100°C
IDM Pulsed Drain Current 11 A
VGS Gate Source Voltage ±20 V
PD @ 25°C Max. Power Dissipation 1 W, TC = 25°C
– Linear Derating Factor 0.0082 W/K (W/°C)
ILM Inductive Current, Clamped 14 A, L = 100 μH
IL Unclamped Inductive Current (Avalanche Current) 1.5 A
TJ, Tstg Operating Junction and Storage Temperature Range -55 to 150 °C
– Lead Temperature (Soldering) 300 °C, 1.6mm from case for 10s
Electrical Characteristics (@ TC = 25°C)
Symbol Parameter Min Typ Max Units
BVDSS Drain Source Breakdown Voltage 50 – – V (VGS = 0V, ID = 250 μA)
VGS(th) Gate Threshold Voltage 2.0 – 4.0 V (VDS = VGS, ID = 250 μA)
IGSS Gate-Source Leakage Forward – – 500 nA (VGS = 20V)
IGSS Gate-Source Leakage Reverse – – -500 nA (VGS = -20V)
IDSS Zero Gate Voltage Drain Current – – 250 μA (VDS = Max Rating, VGS = 0V)
IDSS High Temp. Zero Gate Voltage Drain Current – – 1000 μA (0.8 × Max VDS, VGS = 0V, TC = 125°C)
ID(on) On-State Drain Current 1.7 – – A (VDS > ID(on) × RDS(on)max, VGS = 10V)
RDS(on) Static Drain-Source On-State Resistance – 0.16 0.20 Ω (VGS = 10V, ID = 0.88A)
gfs Forward Transconductance 2.1 3.2 – S (VDS = 2 × VGS, IDS = 3.6A)
Dynamic, Switching & Thermal Characteristics
Symbol Parameter Min Typ Max Units
Ciss Input Capacitance – 250 – pF (VGS = 0V, VDS = 25V, f = 1.0 MHz)
Coss Output Capacitance – 150 – pF
Crss Reverse Transfer Capacitance – 29 – pF
td(on) Turn-On Delay Time – 11 17 ns (VDD = 25V, ID = 7.2A, RG = 25Ω, RD = 3.3Ω)
tr Rise Time – 33 50 ns
td(off) Turn-Off Delay Time – 12 18 ns
tf Fall Time – 23 35 ns
Qg Total Gate Charge – 8.8 13 nC (VGS = 10V, ID = 7.2A Max Rating)
Qgs Gate-Source Charge – 2.2 3.3 nC
Qgd Gate-Drain (“Miller”) Charge – 2.6 3.9 nC
LD Internal Drain Inductance – 4.0 – nH (6mm from package to center of die)
LS Internal Source Inductance – 6.0 – nH (6mm from package to source bonding pad)
RthJA Thermal Resistance, Junction-to-Ambient – 120 – K/W (Typical socket mount)
Source-Drain Diode Ratings & Characteristics
Symbol Parameter Min Typ Max Units
IS Continuous Source Current (Body Diode) – – 1.7 A
ISM Pulse Source Current (Body Diode) – – 14 A
VSD Diode Forward Voltage – – 1.6 V (TJ = 25°C, IS = 1.7A, VGS = 0V)
trr Reverse Recovery Time 41 86 190 ns (TJ = 25°C, IF = 7.2A, dIF/dt = 100A/μs)
QRR Reverse Recovered Charge 0.15 0.33 0.78 μC

Applications
  • Computer mainboards and peripheral circuit boards.
  • Printers and office automation equipment.
  • Telecommunications infrastructure and networking hardware.
  • Consumer electronics and general-purpose power switching products.
Package Content
  • 1 x IRFD010 N-Channel HEXFET Power MOSFET 50V 1.7A DIP-4
DataSheet
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