Product Description
RELIFE RL-404 solder paste is a special type of low-melting solder paste (tin in the form of a paste) intended for soldering electronic components, i.e. SMD, BGA, e.g. in repair processes.
Thanks to the very low melting point of exactly 138 ° C, the use of the paste in this process allows you to perform complex repairs (e.g. replacing the CPU in the iPhone) without exposing other phone components to damage.
Features:
- A low-temperature lead-free solder paste customized for high-end motherboard repair
- Tin lighting/climbing tin strong/high purity/temperature standard / easy to store
- Low-temperature tin paste melting point temperature
- Low melting point
- Effective protection of circuit board components
- Backed by value tin technology
Specifications:
- Particle size (um): 20-38
- Conductivity (%fCu): 14.0
- Flux content (Wt%): 9±0.5
- Viscosity(25°C Pa.s): 178±10
- Weight: 40g
