RELIFE RL-406S Solder Paste 227°C

RELIFE RL-406S Solder Paste 227°C

The RELIFE RL-406S Solder Paste is a high-performance soldering material designed for professional electronics repair and assembly. With a melting point of approximately 227°C, it is suitable for high-temperature applications where strong and reliable solder joints are required. The paste is composed of fine solder particles mixed with flux, providing excellent wettability and smooth flow during reflow processes, resulting in clean and shiny solder joints.

Packaged in a convenient syringe form, the RL-406S allows precise application, reducing waste and improving accuracy when working on small components such as ICs and SMD parts. It maintains good العملability for extended periods after opening and is designed to leave minimal residue, making it ideal for motherboard repair, BGA reballing, and advanced electronics work.

Features:

• High-temperature solder paste (227°C melting point).
• Fine particle size for precision soldering.
• Excellent wettability and strong bonding.
• Syringe design for accurate dispensing.
• No-clean formula with minimal residue.
• Long working time after opening.
• Suitable for professional repair work.
• High purity and smooth solder flow.

Specifications:

Application:

• SMT (Surface Mount Technology) soldering.
• BGA chip reballing and repair.
• PCB assembly and maintenance.
• Mobile phone motherboard repair.
• LED and electronic component soldering.
• Connector, wire, and sensor soldering.

Package Includes:

• 1 × RELIFE RL-406S Solder Paste (10cc syringe).
• 3 × Precision dispensing needles.
• 1 × Plunger (pusher tool).