Rework SMT/BGA Liquid Flux 125mL
The Rework SMT/BGA Liquid Flux 125mL is a high-activity, no-clean flux designed for precision soldering and rework of fine-pitch components. Its formulation ensures excellent wetting and rapid reflow, making it ideal for repairing oxidized solder balls on chipsets without causing lifting. The flux spreads evenly under BGA components, facilitating efficient soldering and reballing processes for PCs, laptops, smartphones, and other sensitive electronic devices. Post-rework, it leaves minimal residue, simplifying the cleaning process.
This flux can be used in both automated and manual soldering applications, it is great for general purpose soldering of electronic boards, wires, semiconductors and SMD/SMT/BGA. It is also ideal for solder coating or tinning leads, it may be applied by spray, or foam for tin soldering applications.
Features:
- Quick repairing of oxidized solder balls for chipset without lifting.
- Fast reflow and evenly spread under (BGA) chipset.
- High quality and activity.
- Non conductive, non corrosive and fungus resistant.
- No residue after rework and easy cleaning.
Usage Recommendations:
- Clean the surface (Clear of any residues or dust).
- Put a little bit of flux.
- Use soldering iron with soldering wick.
- Use hot air soldering station for (SMT) ICs rework at (max180°C).
- Use thinner or any alcohol for cleaning.
Notes:
- Not suitable with dip or wave soldering.
- Not suitable with welding by fusion or flame.
Safety Precautions:
- Close after using & keep away from children.
- Use enough water when eyes or wounds are touched.
Appearance: The flux is a light yellow liquid, packaged in a transparent plastic bottle – (Net Capacity) 125mL.
Applications:
- Rework and repair of SMT/BGA components.
- Soldering and reballing of chipsets in PCs, laptops, and smartphones.
- General-purpose soldering of electronic boards and wires.
- Solder coating or tinning leads.
Package Contents:
- 1x Rework SMT/BGA Liquid Flux 125mL.
