SOMC1603-102G Dale SMD BUSSED RESISTOR NETWORKS 1K Ohm 2% SOP-16

Model Number SOMC1603-102G
Component Description Isolated Resistor Networks 1K Ohm 2% SOP-16.
Datasheet Datasheet

75.00 EGP

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SOMC1603-102G Dale SMD BUSSED RESISTOR NETWORKS 1K Ohm 2% SOP-16

The SOMC1603-102G is a surface-mount bussed resistor network featuring multiple 1kΩ thick-film resistors integrated into a compact SOP-16 package. This resistor array is designed to reduce PCB space usage, simplify circuit assembly, and minimize the number of discrete resistor components required in digital and embedded electronic systems. The bussed configuration connects one side of all resistor elements to a common pin, making the device suitable for pull-up, pull-down, line termination, and LED current limiting applications.

Features:
  • Isolated schematic with 8 separate resistors.
  • Medium body small outline molded DIP package for SMT.
  • Molded case construction for durability.
  • Thick film resistive elements for stable performance.
  • Reflow solderable for modern assembly processes.
  • Compatible with automatic surface mounting equipment.
  • Reduces total assembly costs with integrated network design.
  • Wide resistance range availability from 10Ω to 1MΩ.
  • Low temperature coefficient of ±100ppm/°C.
  • Excellent TC tracking of ±50ppm/°C between resistors.
Specifications:
Parameter Value
Type Thick Film Resistor Network
Schematic Isolated (03 Circuit)
Number of Resistors 8
Resistance Value 1KΩ (1,000Ω)
Tolerance ±2% (G = ±2%)
Power Rating per Element 0.16W at +70°C
Package Power Rating (Max at +70°C) 1.28W
Temperature Coefficient (TCR) ±100ppm/°C (-55°C to +125°C)
TC Tracking ±50ppm/°C (-55°C to +125°C)
Maximum Working Voltage 50VDC
Limiting Element Voltage 50VDC
Voltage Coefficient <50ppm/V
Insulation Voltage (1 min) 200VDC/AC peak
Operating Temperature Range -55°C to +125°C
Storage Temperature Range -55°C to +150°C
Insulation Resistance >10¹⁰Ω minimum
Package Type SOP-16 (Small Outline Package)
Pin Count 16
Body Material Molded epoxy
Terminals Copper alloy, solder dipped
Maximum Solder Reflow Temperature +255°C
Mounting Style Surface Mount (SMD)

Applications
  • Wired OR pull-up configurations.
  • Power driven pull-up applications.
  • Powergate pull-up circuits.
  • Line termination networks.
  • Long-line impedance balancing.
  • LED current limiting.
  • ECL output pull-down networks.
  • TTL input pull-down applications.
 Package Include:

1x SOMC1603-102G Dale SMD BUSSED RESISTOR NETWORKS 1K Ohm 2% SOP-16

Datasheet

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