TE-P1 Pre-Cut Thermal Silicone Pads 100x30x0.5mm (Pack 5 PCS)

TE-P1 Pre-cut thermal silicone pads designed to improve heat transfer between electronic components and heatsinks while providing electrical insulation.

65.00 EGP

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TE-P1 Pre-Cut Thermal Silicone Pads 100x30x0.5mm (Pack 5 PCS)

The TE-P1 Pre-Cut Thermal Silicone Pads are thermal interface materials used to enhance heat dissipation in electronic devices by filling microscopic gaps between heat-generating components and cooling surfaces. Their soft and flexible silicone construction allows them to conform to uneven surfaces, reducing thermal resistance and improving heat transfer efficiency. These pads are commonly used in CPUs, GPUs, memory modules, power components, LED systems, and other heat-sensitive electronics.

With a pre-cut 100 × 30 mm format and a slim 0.5 mm thickness, these thermal pads are convenient for installation and can be further trimmed to fit custom applications. The electrically non-conductive material helps protect sensitive electronic circuits while maintaining effective thermal performance. Their flexibility, durability, and ease of use make them suitable for electronics repair, computer cooling upgrades, embedded systems, and DIY thermal management projects.

Features:
  • High thermal conductivity material.
  • Soft and flexible silicone construction.
  • Pre-cut for easy installation.
  • Electrically non-conductive.
  • Reduces thermal resistance.
  • Fills gaps between components and heatsinks.
  • Suitable for uneven contact surfaces.
  • Easy to cut into custom shapes.
  • Good compressibility.
  • Heat-resistant material.
  • Shock absorption properties.
  • Durable and long-lasting performance.
  • Safe for sensitive electronic components.
  • Suitable for cooling and insulation applications.
Specifications:
Parameter Value
Model TE-P1
Product Type Thermal Silicone Pad
Dimensions 100 × 30 mm
Thickness 0.5 mm
Quantity 5 PCS
Material Thermal Silicone
Color Blue
Electrical Conductivity Non-Conductive
Form Factor Pre-Cut Sheet
Application Thermal Interface Material
Applications:
  • CPU cooling systems.
  • GPU thermal management.
  • SSD heatsink installation.
  • RAM cooling solutions.
  • Motherboard chipset cooling.
  • Power supply components.
  • LED heat dissipation.
  • Voltage regulator cooling.
  • Embedded electronics.
  • Mobile device repair.
  • Industrial control electronics.
  • DIY electronics projects.
  • Electronic maintenance and servicing.
Package Includes:
  • 5x TE-P1 Pre-Cut Thermal Silicone Pads 100x30x0.5mm.
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