MDP16-1-121 BUSSED RESISTOR NETWORKS 120Ω DIP-16

MDP16-1-121 bussed resistor network, 120Ω, 16-pin DIP, 0.125W per element, ±2% tolerance. 15 resistors with common pin for pull-up/pull-down applications

75.00 EGP

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MDP16-1-121 BUSSED RESISTOR NETWORKS 120Ω DIP-16

The MDP16-1-121 is a bussed resistor network array featuring multiple 120Ω resistors integrated into a compact DIP-16 through-hole package. This resistor network is designed to reduce PCB space usage, simplify circuit assembly, and minimize the number of discrete components required in digital and electronic systems. The bussed configuration connects one terminal of all resistor elements to a common pin, making the device ideal for pull-up, pull-down, LED current limiting, and signal termination applications.

Features:
  • Bussed schematic with 15 resistors and one common pin.
  • 0.160″ (4.06mm) maximum seated height for compact designs.
  • Rugged molded case construction for durability.
  • Thick film resistive elements for stable performance.
  • Low temperature coefficient of ±100ppm/°C.
  • Excellent TC tracking of ±50ppm/°C between resistors.
  • Reduces total assembly costs with integrated network design.
  • Compatible with automatic inserting equipment.
  • Wide resistance range availability from 10Ω to 2.2MΩ.
  • Uniform performance characteristics across all elements.
Specifications:
Type Thick Film Resistor Network
Schematic Bussed (01)
Number of Resistors 15
Resistance Value 120Ω
Tolerance ±2% (Standard), ±1% and ±5% available
Power Rating per Element 0.125W at +70°C
Package Power Rating (Max at +70°C) 1.92W
Temperature Coefficient (TCR) ±100ppm/°C (-55°C to +125°C)
TC Tracking ±50ppm/°C (-55°C to +125°C)
Maximum Operating Voltage 100VDC
Voltage Coefficient of Resistance <50ppm/°C/V typical
Operating Temperature Range -55°C to +125°C
Storage Temperature Range -55°C to +150°C
Insulation Resistance >10,000MΩ minimum
Dielectric Withstanding Voltage 200VRMS
Package Type DIP-16 (Dual-In-Line)
Pin Count 16
Seated Height 0.160″ (4.06mm) maximum
Weight 1.5g
Body Material Molded epoxy
Terminals Solder plated leads
Mounting Style Through-Hole
Applications:
  • MOS/ROM pull-up and pull-down networks.
  • Open collector pull-up circuits.
  • Wired OR pull-up configurations.
  • Power driven pull-up applications.
  • TTL input pull-down networks.
  • Digital pulse squaring circuits.
  • TTL unused gate pull-up configurations.
  • High speed parallel pull-up applications.
Package Include:

1x MDP16-1-121 BUSSED RESISTOR NETWORKS 120Ω DIP-16

Datasheet

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