Universal BGA Reballing Stencil Plate 33 in 1

The Universal BGA Reballing Stencil Plate (33 in 1) is a practical and efficient tool designed for reballing and repairing BGA (Ball Grid Array) components. This stencil plate consolidates 33 popular chip layouts into a single, compact design. Crafted for precision and durability, it is an essential accessory for electronic repair professionals and DIY enthusiasts dealing with micro soldering and chip rework.

Features:

• 53 Layouts in One Plate where accommodates various BGA chip sizes and patterns, enhancing its utility and compatibility.
• Durable Material where made from high-quality stainless steel for long-lasting performance and resistance to heat and wear.
• High Precision where laser-cut holes for accurate solder paste application and reballing.
• Compact Design where lightweight and portable, making it easy to integrate into repair toolkits.
• Universal Compatibility where supports a wide range of chip manufacturers and configurations.
• Designed for multiple uses, ensuring cost-effectiveness.
• Heat-Resistant where withstands high soldering temperatures without deformation.

Specifications:

• Item Type: BGA Reballing Stencil Plate
• Material: Stainless steel
• Color: Silver
• Finish: Polished for smooth handling and durability
• Number of Layouts: 33
• Thickness(Approx.): 0.1 mm
• Standard Size Dimensions(L x W): 19.5 cm x 8.5 cm
• Hole Accuracy: ±0.01 mm
• Compatibility: Suitable for ICs, CPUs, GPUs, and other BGA components

Applications:

• Electronics Repair.
• Chip Reballing.
• Prototype Development.
• Training and Education.
• DIY Electronics Projects.