The Universal BGA Reballing Stencil Plate (33 in 1) is a practical and efficient tool designed for reballing and repairing BGA (Ball Grid Array) components. This stencil plate consolidates 33 popular chip layouts into a single, compact design. Crafted for precision and durability, it is an essential accessory for electronic repair professionals and DIY enthusiasts dealing with micro soldering and chip rework.
Features:
- 53 Layouts in One Plate where accommodates various BGA chip sizes and patterns, enhancing its utility and compatibility.
- Durable Material where made from high-quality stainless steel for long-lasting performance and resistance to heat and wear.
- High Precision where laser-cut holes for accurate solder paste application and reballing.
- Compact Design where lightweight and portable, making it easy to integrate into repair toolkits.
- Universal Compatibility where supports a wide range of chip manufacturers and configurations.
- Designed for multiple uses, ensuring cost-effectiveness.
- Heat-Resistant where withstands high soldering temperatures without deformation.
Specifications:
- Item Type: BGA Reballing Stencil Plate
- Material: Stainless steel
- Color: Silver
- Finish: Polished for smooth handling and durability
- Number of Layouts: 33
- Thickness(Approx.): 0.1 mm
- Standard Size Dimensions(L x W): 19.5 cm x 8.5 cm
- Hole Accuracy: ±0.01 mm
- Compatibility: Suitable for ICs, CPUs, GPUs, and other BGA components
Applications:
- Electronics Repair.
- Chip Reballing.
- Prototype Development.
- Training and Education.
- DIY Electronics Projects.
