MDP16-1-151 Bussed Resistor Networks 150Ω DIP-16

MDP16-1-151 bussed resistor network, 150Ω, 16-pin DIP, 0.125W per element, ±2% tolerance. 15 resistors with common pin for pull-up/pull-down applications

75.00 EGP

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M16A BUSSED RESISTOR NETWORKS 150Ω DIP-16

The MDP16-1-151 is a bussed resistor network array featuring multiple 150Ω thick-film resistors integrated into a compact DIP-16 through-hole package. This resistor network is designed to simplify PCB layouts, reduce discrete component count, and improve assembly efficiency in digital and electronic circuits. The bussed configuration connects one side of all resistor elements to a common pin, making the device suitable for pull-up, pull-down, LED current limiting, and digital signal termination applications.

Features
  • Bussed schematic with 15 resistors and one common pin.
  • 0.160″ (4.06mm) maximum seated height for compact designs.
  • Rugged molded case construction for durability.
  • Thick film resistive elements for stable performance.
  • Low temperature coefficient of ±100ppm/°C.
  • Excellent TC tracking of ±50ppm/°C between resistors.
  • Reduces total assembly costs with integrated network design.
  • Compatible with automatic inserting equipment.
  • Wide resistance range availability from 10Ω to 2.2MΩ.
  • Uniform performance characteristics across all elements.
Specifications:
Parameter Value
Type Thick Film Resistor Network
Schematic Bussed (01)
Number of Resistors 15
Resistance Value 150Ω
Tolerance ±2% (Standard), ±1% and ±5% available
Power Rating per Element 0.125W at +70°C
Package Power Rating (Max at +70°C) 1.92W
Temperature Coefficient (TCR) ±100ppm/°C (-55°C to +125°C)
TC Tracking ±50ppm/°C (-55°C to +125°C)
Maximum Operating Voltage 100VDC
Voltage Coefficient of Resistance <50ppm/°C/V typical
Operating Temperature Range -55°C to +125°C
Storage Temperature Range -55°C to +150°C
Insulation Resistance >10,000MΩ minimum
Dielectric Withstanding Voltage 200VRMS
Package Type DIP-16 (Dual-In-Line)
Pin Count 16
Terminals Solder plated leads
Mounting Style Through-Hole

Applications
  • MOS/ROM pull-up and pull-down networks.
  • Open collector pull-up circuits.
  • Wired OR pull-up configurations.
  • Power driven pull-up applications.
  • TTL input pull-down networks.
  • Digital pulse squaring circuits.
  • TTL unused gate pull-up configurations.
  • High speed parallel pull-up applications.
Package Include:

1x MDP16-1-151 Bussed Resistor Networks 150Ω DIP-16

Datasheet
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